PRODUCT
Air-Gap Product
  AIR GAP FPC is FPC which is constructed by 2 layers or over off CCL (Cu & Base). And these CCL materials are laminated with Thermo Setting Adhesive (TSA) like Muti - layer FPC. But TSA doesn't exist at same areas. It means CCLs are laminated each other partly. And this areas (non lamination area) is called as AIR - GAP area. Because each CCLs arestayed individually. This structure can make high flexibility and density.
 
(4 layers)
 
Base material
Polyimide film   12.5 m(1/2 mil), 25 m(1 mil)
Copper foil   18 m(1/2 oz), 35 m(1 oz)
Cover material
Polyimide film   12.5 m, 25 m, 35 m
Resist  
Polyimide, Ink : Silver Paste , Black Ink
Circuit
Pitch   100 m
Minimum line   50   m
Minimum space  
50   m
Via
Through Hole   0.15mm
LVH   0.10mm
Thickness   7 - 13 m
Surface treatment Solder Electrolytic Plating
Gold Electrolytic Plating
Anti-Tarnish
Layers 4 layers
 

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