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Surface Mount Technology (SMT) |
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Surface mount technology (SMT) is a method for constructing electronic circuits in which the components are mounted directly onto the surface of flexible printed circuit (FPC).
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A state-of-the-art construction method for flexible printed circuit (FPC). The electronic components are attached to the top and or bottom surfaces of the FPC. The leads of the components are soldered to pads and do not pass through the FPC as with the older 'through-hole' method. |
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A flip chip product is one type of mounting technology used for semiconductor devices, such as IC chips, which does not require any wire bonds. Instead the final wafer processing step deposits solder beads on the chip pads. After cutting the wafer into individual dice, the "flip chip" is then mounted upside down in/on the package(FPC).(interconnection on copper or nickel/gold) and then solder reflowed,finally by underfilled and overcoat with an epoxy resin. |
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